Polyamide compositions and articles incorporating the same

ABSTRACT

Compositions including a polyamide, and compaction rollers for an automated fiber placement machine incorporating the composition are provided. The polyamide may be a reaction product of at least one diamine and an aromatic dicarboxylic acid, a hydroxy benzoic acid, or their respective ester or acyl halide derivatives. The at least one diamine may include an amino terminated perfluorinated alkyl ether polymer or oligomer. The composition may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm−1K−1).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 63/082,390, filed on Sep. 23, 2020, the disclosure of which isincorporated herein by reference in its entirety.

STATEMENT OF GOVERNMENT INTEREST

This invention was made with Government support under (SAA1-21157;SAA1-21157, Annex 17; and SAA1-21157, Annex 17, MOD 1) awarded by NASA.The government has certain rights in this invention.

The invention described herein may be manufactured and used by or forthe U.S. Government for U.S. Government purposes without the payment ofroyalties thereon or therefor.

TECHNICAL FIELD

The present disclosure relates to the field of polyamide compositions,composites thereof, and articles of manufacture incorporating the same,more particularly, to components, such as compliant components forautomated fiber placement machines.

BACKGROUND

Fabricating relatively large, highly contoured structures from compositematerials for aerospace primary structures is challenging and thus islargely limited to hand layup techniques that are not only laborintensive but may not be well suited for high production volumeapplications. Automated fiber placement (AFP) machines may be used tofabricate large acreage composite structures. However, AFP machines maynot be efficient for producing highly contoured structures with tightradii. For example, some conventional rollers of AFP machines are oftenfabricated from metal (e.g., stainless steel). The metal rollers lackthe conformability or flexibility necessary to fabricate complexcontoured surfaces. In view of the foregoing, some conventional rollersof AFP machines utilize a soft polymer (e.g., polyurethane). While thesesoft polymer rollers exhibit the conformability needed for complexcontoured surfaces, they lack the thermal conductivity to efficientlydissipate heat, particularly during high temperature layups, therebyresulting in roller wraps. Poor heat dissipation may also lead to rollerdegradation, thereby introducing foreign object debris (FOD) to thepart.

What is needed, then, are compositions for compliant rollers of AFPmachines having improved properties and methods for the same.

BRIEF SUMMARY

This summary is intended merely to introduce a simplified summary ofsome aspects of one or more implementations of the present disclosure.Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. Thissummary is not an extensive overview, nor is it intended to identify keyor critical elements of the present teachings, nor to delineate thescope of the disclosure. Rather, its purpose is merely to present one ormore concepts in simplified form as a prelude to the detaileddescription below.

The foregoing and/or other aspects and utilities embodied in the presentdisclosure may be achieved by providing a composition including apolyamide. The polyamide may be a polymeric reaction product of anaromatic dicarboxylic acid, a hydroxy benzoic acid, or their respectiveester or acyl halide derivatives, and at least one diamine. The at leastone diamine may include an amino terminated perfluorinated alkyl etherpolymer or oligomer. The composition may include a thermal conductivityof from about 0.2 to about 50 Watts per meter Kelvin (Wm⁻¹K⁻¹).

In at least one implementation, that at least one diamine may include aphenylenediamine.

In at least one implementation, the phenylenediamine may include one ormore of m-phenylenediamine, p-phenylenediamine, or combinations thereof.

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by one or more ofstructures (1), (2), (3), (4), (5), (6), (7), (8), or combinationsthereof.

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by one or more ofstructures (1), (2), or combinations thereof.

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by structure (3).

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by one or more ofstructures (4), (5), or combinations thereof.

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by one or more ofstructures (6), (7), or combinations thereof.

In at least one implementation, the amino terminated perfluorinatedalkyl ether polymer or oligomer may be represented by structure (8).

In at least one implementation, the at least one diamine may be presentin an amount of from greater than 0 weight % to about 20 weight %, bytotal weight of the diamines utilized in the synthesis of the polyamide

In at least one implementation, the composition may further include oneor more thermally conductive fillers. The thermally conductive fillersmay include one or more of a carbon-based filler, boron nitride, ametal, or combinations thereof.

In at least one implementation, the thermally conductive fillers mayinclude the carbon-based filler. The carbon-based filler may include oneor more of expanded graphite, carbon fibers, carbon nanotubes, carbonblack, graphite, graphene, derivatives thereof, or combinations thereof.

In at least one implementation, the carbon-based filler may include thecarbon fibers. The carbon fibers may include one or more of carbonnanofibers, metallized carbon nanofibers, vapor grown carbon nanofibers,or combinations thereof.

In at least one implementation, the carbon fibers may include themetallized carbon nanofibers. The metallized carbon nanofibers mayinclude carbon nanofibers coated or covalently bound with one or more ofsilver, copper, nickel, or combinations thereof.

In at least one implementation, the thermally conductive fillers mayinclude the carbon-based filler. The carbon-based filler may befunctionalized with one or more of a conductive metal, an aliphaticgroup, or combinations thereof.

In at least one implementation, the thermally conductive fillers mayinclude the carbon-based filler. The carbon-based filler may includecarbon nanotubes. The carbon nanotubes may include one or more ofmulti-walled carbon nanotubes, single-walled carbon nanotubes, orcombinations thereof.

In at least one implementation, the thermally conductive fillers mayinclude the metal. The metal may be in the form of particles, strands,or combinations thereof. The metal may include one or more of aluminum,nickel, or combinations thereof.

The foregoing and/or other aspects and utilities embodied in the presentdisclosure may be achieved by providing a roller including a compositionincluding a polyamide. The polyamide may be a polymeric reaction productof an aromatic dicarboxylic acid, a hydroxy benzoic acid, or theirrespective ester or acyl halide derivatives, and at least one diamine.The at least one diamine may include an amino terminated perfluorinatedalkyl ether polymer or oligomer. The composition may include a thermalconductivity of from about 0.2 to about 50 Watts per meter Kelvin(Wm⁻¹K⁻¹). The roller may have a water contact angle of greater than95°.

The foregoing and/or other aspects and utilities embodied in the presentdisclosure may be achieved by providing a compaction roller for anautomated fiber placement machine. The compaction roller may include abody having an outer layer. The outer layer of the body may include acomposition including a polyamide. The polyamide may be a polymericreaction product of an aromatic dicarboxylic acid, a hydroxy benzoicacid, or their respective ester or acyl halide derivatives, and at leastone diamine. The at least one diamine may include an amino terminatedperfluorinated alkyl ether polymer or oligomer. The composition mayinclude a thermal conductivity of from about 0.2 to about 50 Watts permeter Kelvin (Wm⁻¹K⁻¹).

The foregoing and/or other aspects and utilities embodied in the presentdisclosure may be achieved by providing a compaction roller for anautomated fiber placement machine. The compaction roller may include abody where the entire body of the compaction roller is fabricated from acomposition including a polyamide. The polyamide may be a polymericreaction product of an aromatic dicarboxylic acid, a hydroxy benzoicacid, or their respective ester or acyl halide derivatives, and at leastone diamine. The at least one diamine may include an amino terminatedperfluorinated alkyl ether polymer or oligomer. The composition mayinclude a thermal conductivity of from about 0.2 to about 50 Watts permeter Kelvin (Wm⁻¹K⁻¹).

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating some typical aspects of the disclosure, are intended forpurposes of illustration only and are not intended to limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate the present teachings and,together with the description, serve to explain the principles of thedisclosure. In the FIGURES:

FIG. 1 illustrates a portion of an exemplary automated fiber placementmachine, according to one or more embodiments disclosed.

DETAILED DESCRIPTION

The following description of various typical aspect(s) is merelyexemplary in nature and is in no way intended to limit the disclosure,its application, or uses.

As used throughout this disclosure, ranges are used as shorthand fordescribing each and every value that is within the range. It should beappreciated and understood that the description in a range format ismerely for convenience and brevity, and should not be construed as aninflexible limitation on the scope of any embodiments or implementationsdisclosed herein. Accordingly, the disclosed range should be construedto have specifically disclosed all the possible subranges as well asindividual numerical values within that range. As such, any value withinthe range may be selected as the terminus of the range. For example,description of a range such as from 1 to 5 should be considered to havespecifically disclosed subranges such as from 1.5 to 3, from 1 to 4.5,from 2 to 5, from 3.1 to 5, etc., as well as individual numbers withinthat range, for example, 1, 2, 3, 3.2, 4, 5, etc. This appliesregardless of the breadth of the range.

Unless otherwise specified, all percentages and amounts expressed hereinand elsewhere in the specification should be understood to refer topercentages by weight.

Additionally, all numerical values are “about” or “approximately” theindicated value, and take into account experimental error and variationsthat would be expected by a person having ordinary skill in the art. Itshould be appreciated that all numerical values and ranges disclosedherein are approximate values and ranges, whether “about” is used inconjunction therewith. It should also be appreciated that the term“about,” as used herein and in conjunction with a numeral, refers to avalue that may be ±0.01% (inclusive), ±0.1% (inclusive), ±0.5%(inclusive), ±1% (inclusive), ±2% (inclusive), ±3% (inclusive), ±5%(inclusive), ±10% (inclusive), or ±15% (inclusive) of that numeral. Itshould further be appreciated that when a numerical range is disclosedherein, any numerical value falling within the range is alsospecifically disclosed.

As used herein, “free” or “substantially free” of a material may referto a composition, component, or phase where the material is present inan amount of less than 10.0 weight %, less than 5.0 weight %, less than3.0 weight %, less than 1.0 weight %, less than 0.1 weight %, less than0.05 weight %, less than 0.01 weight %, less than 0.005 weight %, orless than 0.0001 weight % based on a total weight of the composition,component, or phase.

All references cited herein are hereby incorporated by reference intheir entireties. In the event of a conflict in a definition in thepresent disclosure and that of a cited reference, the present disclosurecontrols.

Compositions, composites, coatings, layers, and/or articles ofmanufacture disclosed herein (hereinafter referred to as “materials”)may comprise polyamides formed from a polymeric reaction product of anaromatic dicarboxylic acid (e.g., terephthalic acid), aromatic hydroxybenzoic acid (e.g., any one or more of o-hydroxybenzoic acid,m-hydroxybenzoic acid, and/or p-hydroxybenzoic acid) or ester or acylhalide derivatives thereof, and at least one diamine. The polyamides maybe formed from the reaction of the aromatic dicarboxylic acid, thearomatic hydroxy benzoic acid, or the ester or acyl halide derivativethereof, and the one or more diamines under any suitable condition, suchas under condensation polymerization conditions.

In an exemplary embodiment, the materials may include the polyamidesformed from the polymeric reaction product of the aromatic dicarboxylicacid, aromatic hydroxy benzoic acid, or an ester or acyl halidederivative thereof, and the at least one diamine, one or more additionalpolyamides, one or more additional polymers, one or more thermallyconductive fillers, or combinations thereof.

As used herein, the expression “Shore A hardness” may refer to a measureof a hardness of a polymeric material, such as an elastomer, where arelatively higher number indicates a relatively greater resistance toindentation and thus a harder material, and where a relatively lowernumber indicates a relatively lower resistance to indentation and thus asofter material. The Shore A hardness may be measured with a durometergauge or tester. It should be appreciated that the Shore A hardness ofthe materials disclosed herein may relate to a conformability of thematerials disclosed herein.

The materials utilizing the compositions disclosed herein may have aShore A hardness of from about 20 to about 80. For example, thematerials disclosed herein may have a Shore A hardness of from about 20,about 30, or about 40 to about 50, about 70, or about 80. In at leastone embodiment, the materials disclosed herein may exhibit or have aShore A hardness of from about 20 to about 80 at temperatures of fromabout 200° C. to about 500° C. For example, the materials disclosedherein may exhibit or have a Shore A hardness of from about 20 to about80 at temperatures of from about 200° C., about 250° C., or about 300°C. to about 350° C., about 400° C., or about 500° C.

As used herein, the expression “water contact angle” may refer to theangle that deionized water contacts a surface of the materials disclosedherein. The water contact angle may be measured with any suitablegoniometer. The materials disclosed herein may exhibit or have a watercontact angle of greater than about 85°, greater than about 90°, greaterthan about 95°, or greater than about 100°. It should be appreciatedthat the water contact angle may relate to the anti-stick, non-stick, orotherwise the adhesion properties of the materials disclosed herein. Thewater contact angle may also relate to surface energy of the material.

In at least one embodiment, the materials disclosed herein may exhibitrelatively low surface energies of from about 25 mN/m or less, forexample, from about 0.1 to about 25 mN/m, about 0.1 to about 20 mN/m,from about 0.5 mN/m to about 15 mN/m, or about 0.5 mN/m to about 5 mN/m.

As used herein, the expression “thermal conductivity” may refer to anability of a material to conduct heat. The materials disclosed hereinmay have a thermal conductivity of from about 0.2 to about 50 Watts permeter Kelvin (Wm⁻¹K⁻¹). For example, the materials may have a thermalconductivity of from about 0.2 Wm⁻¹K⁻¹, about 1 Wm⁻¹K⁻¹, about 5Wm⁻¹K⁻¹, or about 10 Wm⁻¹K⁻¹ to about 20 Wm⁻¹K⁻¹, about 30 Wm⁻¹K⁻¹,about 40 Wm⁻¹K⁻¹, or about 50 Wm⁻¹K⁻¹.

The materials disclosed herein may have a tensile strength of from about500 psi to about 4,000 psi. For example, the materials disclosed hereinmay have a tensile strength of from about 500 psi, about 1000 psi, about1500 psi, or about 2000 psi to about 2500 psi, about 3000 psi, or about4000 psi.

The dicarboxylic acid may be or include, but is not limited to, one ormore of ortho-phthalic acid, meta-phthalic acid, para-phthalic acid,and/or combinations thereof. Other dicarboxylic acids may include butare not limited to naphthalene-2,6-dicarboxylic acid,naphthalene-1,4-dicarboxylic acid, biphenyl-4,4′-dicarboxylic acid,diphenyl sulfone-4,4′-dicarboxylic acid, pyridine-2,6-dicarboxylic acid,2,5-furan dicarboxylic acid, and/or combinations thereof. Likewise,methyl or ethyl ester derivatives of these dicarboxylic acids areincluded as well as acyl halide derivatives of these dicarboxylic acids.The use of these aromatic dicarboxylic acids and their ester and acylhalide derivatives are well-established in the synthesis of polyamides.

The at least one diamine for forming the polyamides may be or includeone or more of a phenylenediamine, an amino terminated perfluorinatedalkyl ether polymer or oligomer, or combinations thereof. In at leastone embodiment, the at least one diamine for forming the polyamidesincludes a combination of a phenylenediamine and an amino terminatedperfluorinated alkyl ether polymer or oligomer.

The phenylenediamine may be or include one or more ofo-phenylenediamine, m-phenylenediamine, p-phenylenediamine, orcombinations thereof. In an exemplary embodiment, the phenylenediamineincludes or predominantly includes p-phenylenediamine.

The amino terminated perfluorinated alkyl ether polymer or oligomer ofthe diamine may be included as a surface modifying agent. The aminoterminated perfluorinated alkyl ether polymer or oligomer of the diaminemay include one or more of structures (1), (2), (3), (4), (5), (6), (7),(8), or combinations thereof:

The fluorine-containing portions or segments of the amino terminatedperfluorinated alkyl ether polymer or oligomer may be available tomigrate to an exterior surface (e.g., air surface) of the materialsdisclosed herein. For example, the fluorine-containing portions orsegments of the amino terminated perfluorinated alkyl ether polymer oroligomer may be available to migrate to respective exterior surfaces ofthe materials during the fabrication or synthesis thereof. The migrationof the fluorine-containing portions to the surfaces of the materials maycontribute to or facilitate the formation of surfaces with low energy oranti-stick surfaces. The migration of the fluorine-containing portionsto the respective surfaces may also allow the materials to exhibit acombination of bulk and surface properties. For example, the migrationof the fluorine-containing portions to the respective surfaces of thematerials may result in materials that are anisotropic (e.g., chemicallyanisotropic) relative to a direction along a thickness thereof. As such,it should be appreciated that the migration of the fluorine-containingportions to the respective surfaces may provide selectively fluorinatedsurfaces that provide relatively low or minimal adhesion (e.g., highwater contact surface) while maintaining bulk properties (e.g.,mechanical and thermal properties) throughout the compositions, thematerials.

The at least one diamine may also include additional diamines, such asaliphatic or aromatic diamines, including diamines containing otherhetero atoms. Illustrative additional diamines of the one or morediamines may be or include, but are not limited to, aliphatic diaminessuch as trimethylenediamine, tetramethylenediamine,pentamethylenediamine, hexamethylenediamine,2,2,4-trimethylhexamethylenediamine,2,4,4-trimethylhexamethylenediamine, octamethylenediamine andnonamethylenediamine; and an alicyclic diamine such asbis(4-aminocyclohexyl)methane andbis(4-amino-3-methylcyclohexyl)methane; aromatic diamines, for example,phenylenediamine, diaminotoluene, 2,4-diaminomesitylene,3,5-diethyl-2,6-diaminotoluene, xylylenediamine (in particular,meta-xylylenediamine, para-xylylenediamine), bis(2-aminoethyl)benzene,biphenylenediamine, a diamine having a biphenyl backbone (e.g.,4,4′-diamino-3,3′-ethylbiphenyl), a diamine having a diphenyl alkanebackbone [e.g., diaminodiphenylmethane,bis(4-amino-3-ethylphenyl)methane, bis(4-amino-3-methylphenyl)methane,3,3′-dichloro-4,4′-diaminodiphenylmethane,2,2′-bis(4-aminophenyl)propane], bis(4-aminophenyl)ketone,bis(4-aminophenyl)sulfone, or 1,4-naphthalenediamine, and anN-substituted aromatic diamine thereof alicyclic diamine such as1,3-cyclopentanediamine, 1,4-cyclohexanediamine, andbis(4-amino-3-methylcyclohexyl)methane; an aliphatic amine, such astrimethylenediamine, tetramethylenediamine, penamethylenediamine,hexamethylenediamine, 2,2,4-trimethylhexamethylenediamine,2,4,4-trimethylhexamethylenediamine, and octamethylenediamine, and anN-substituted aliphatic diamine thereof; and ether diamines such aspoly(alkylene ether)diamines including poly(ethylene ether)diamine,poly(propylene ether)diamine, poly(tetramethylene ether)diamine; randomor block copolymers of ethylene oxide and propylene oxide includingpropylene oxide and poly(propylene oxide) terminated poly(ethyleneether)diamine, 4,4′-oxydianiline; and aminated random or blockcopolymers of tetrahydrofuran with minor amounts of a second monomersuch as ethylene oxide, propylene oxide, methyl tetrahydrofuran,bis[4-(3-aminophenoxy)phenyl]methane,bis[4-(4-aminophenoxy)phenyl]methane,1,1-bis[4-(3-aminophenoxy)phenyl]ethane,1,1-bis[4-(4-aminophenoxy)phenyl]ethane,1,2-bis[4-(3-aminophenoxy)phenyl]ethane,1,2-bis[4-(4-aminophenoxy)phenyl]ethane,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]butane,2,2-bis[4-(4-aminophenoxy)phenyl]butane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4′-bis(3-aminophenoxy)biphenyl, 4,4′-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone, bis[4-(4-aminophenoxy)phenyl]ketone, bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl] sulfone, or combinations thereof.

The at least one diamine may include one or more of the amino terminatedperfluorinated alkyl ether polymers or oligomers represented by one ormore of structures (1)-(8) or combinations thereof, the one or morephenylenediamines, the one or more additional diamines, or combinationsthereof. In at least one embodiment, the amino terminated perfluorinatedalkyl ether polymer or oligomer represented by one or more of structures(1)-(8) may be present in an amount of from greater than 0 weight % toless than or equal to 20 weight %, by total weight of the diaminesutilized in the synthesis of the polyamide. For example, the aminoterminated perfluorinated alkyl ether polymers or oligomers representedby one or more of structures (1)-(8) may be present in an amount of fromabout 0.1 weight %, about 0.5 weight %, or about 1 weight % to about 3weight %, about 5 weight %, about 10 weight %, or about 20 weight %, bytotal weight of the diamines utilized in the synthesis of the polyamide.

The amino terminated perfluorinated alkyl ether polymers or oligomersrepresented by one or more of structures (1)-(8) may at least partiallydetermine a water contact angle of the materials including thecomposition or the composite disclosed herein. For example, the amountof the amino terminated perfluorinated alkyl ether polymers or oligomerspresent may at least partially determine the water contact angle of thematerials including the compositions or the composites. As such, itshould be appreciated that the amount of the amino terminatedperfluorinated alkyl ether polymers or oligomers utilized in thesynthesis of the polyamide may be at least partially determined by adesired water contact angle for the materials. In at least oneembodiment, the amino terminated perfluorinated alkyl ether polymers oroligomers may be present in an amount of from about from greater than 0weight % to about 20 weight %, by total weight of the diamines utilizedin the synthesis of the polyamide. For example, the amino terminatedperfluorinated alkyl ether polymers or oligomers may be present in anamount of from greater than 0 weight %, greater than 1 weight %, orgreater than 2 weight % to less than or equal to 20 weight %, less thanor equal to 10 weight %, or less than or equal to 5 weight %, by totalweight of the diamines utilized in the synthesis of the polyamide. In atleast one embodiment, the amount of the amino terminated perfluorinatedalkyl ether polymers or oligomers may be sufficient to provide thematerials with a water contact angle of at least 85°, at least 90°, orat least 95°.

The polymeric reaction between the aromatic dicarboxylic acid, monobenzoic acid such as hydroxy benzoic acid, or their ester or acyl halidederivatives and the at least one diamine may be conducted in thepresence of one or more organic solvents. Illustrative organic solventsmay be or include, but are not limited to, N,N-dimethylformamide,N,N-dimethylacetamide, N,N-diethylacetamide,N,N-dimethylmethoxyacetamide, N-methyl-2-pyrrolidone,1,3-dimethyl-2-imidazolidinone, N-methylcaprolactam,1,2-dimethoxyethane, bis(2-methoxyethyl) ether,1,2-bis(2-methoxyethoxy)ethane, bis[2-(2-methoxyethoxy)ethyl] ether,tetrahydrofuran, 1,3-dioxane, 1,4-dioxane, pyridine, picoline (e.g., anyisomers of methylpyridine), dimethylsulfoxide, dimethylsulfone,tetramethylurea hexamethylphosphoramide, or combinations thereof. Thepolymeric reaction may be carried out at a temperature of from about 15°C. to about 75° C., or from about 15° C. to about 50° C. The polymericreaction may be conducted at any suitable pressure (e.g., ambientpressure). The polymeric reaction may be conducted under a dry inertatmosphere, such as nitrogen, helium, argon, or combinations thereof. Itshould be appreciated that reaction times of the polymeric reaction mayvary, and may be at least partially dependent on one or more of thereactants, solvents, temperature of reaction, or combinations thereof.In at least one embodiment, the polymeric reaction may include heating.For example, heating at a temperature of from about 120° C., about 150°C., or about 200° C. to about 300° C., about 350° C., or about 400° C.

In at least one embodiment, the polymeric reaction product may be orinclude a block co-polymer. In another embodiment, the polymericreaction product may be or include a random co-polymer. In anotherembodiment, the polymeric reaction product may be or include a structureincorporating portions of both a random co-polymer and a blockcopolymer.

As disclosed above, the materials disclosed herein may include thepolyamides formed from the polymeric reaction product of an aromaticdicarboxylic acid or a hydroxy benzoic acid including ester or acylhalide derivatives thereof and the at least one diamine, one or moreadditional polyamides, one or more additional polymers, one or morethermally conductive fillers, or combinations thereof. The one or morethermally conductive fillers may be capable of or configured to modifyone or more properties of the materials incorporating the same. Forexample, the one or more thermally conductive fillers may be capable ofor configured to modify a thermal conductivity of the materials. Assuch, the thermally conductive fillers may be capable of or configuredto increase or improve the dissipation of heat in the materials. Otherproperties of the materials that may be modified by the thermallyconductive fillers may be or include, but are not limited to, one ormore of mass, density, volume, tensile strength, flexibility,elasticity, coefficient of thermal expansion, wear resistance,hydrophobicity, surface friction, or combinations thereof. The thermallyconductive fillers may have a major dimension of greater than 10 nm,greater than 50 nm, or greater than 100 nm and less than about 5 μm,less than about 500 nm, less than about 200 nm, or less than about 100nm. Illustrative thermally conductive fillers may be or include, but arenot limited to, one or more of a carbon-based filler, inorganiccompounds (e.g., boron nitride), a metal, or combinations thereof.

The carbon-based fillers may be or include, but are not limited to, oneor more carbon based particles (e.g., nanoparticles), such as expandedgraphite, carbon fibers, carbon nanotubes, carbon black, graphite,graphene, carbon nanofibers, derivatives thereof, or combinationsthereof.

In at least one embodiment, any one or more of the carbon-based fillersmay be functionalized and/or surface treated. For example, thecarbon-based fillers may be functionalized with one or more conductivemetals, conductive metal oxides, and/or combinations thereof.Illustrative aliphatic groups may be or include, but are not limited to,methyl, ethyl, propyl isomers, butyl isomers, pentyl isomers, includingcyclopentane, hexane isomers, including cyclohexane, or other aliphaticderivatives including up to about 12 carbon atoms. Illustrativeconductive metals and conductive metal oxides, may be or include, butare not limited to, silver, gold, copper, nickel, palladium, platinum,ruthenium, rhodium, aluminum oxide, nickel oxide, copper oxides,titanium oxides, zinc oxides, other conductive metals or conductivemetal oxides, or the like, and/or combinations thereof.Functionalization of the carbon-based fillers may at least partiallyfacilitate the dispersion of the carbon-based fillers within thematerials disclosed herein.

The carbon fiber may include one or more of carbon nanofibers (CNFs),metallized CNFs, vapor grown CNFs, and/or combinations thereof. Themetallized carbon nanofibers may include CNFs coated and/or covalentlybound with one or more metals and/or metal oxides. Illustrative metalsand/or metal oxides coated on the CNFs, may be or include, but are notlimited to, silver, gold, copper, nickel, palladium, platinum,ruthenium, rhodium, aluminum oxide, nickel oxide, copper oxides,titanium oxides, zinc oxides, other conductive metals or metal oxides,or the like, or combinations thereof. In an exemplary embodiment, thecarbon fiber may include silver metallized or coated CNFs, coppermetallized or coated CNFs, nickel metallized or coated CNFs, and/orcombinations thereof.

The carbon nanotubes may include carbon-based molecules having agenerally elongated, hollow, tubular structure. The hollow, tubularstructure of the carbon nanotubes may be formed from two-dimensionalsheets of hexagonally arrayed carbon atoms having a thickness of asingle carbon atom, referred to as graphene. The two-dimensional sheetsof graphene may be rolled along various angles to provide the tubularstructures of the carbon nanotubes. The two-dimensional sheets ofgraphene may also form carbon nanotubes with tubular structures havingvarying diameters. The angles in which the two-dimensional sheets ofgraphene are rolled and/or the diameter of the resulting tubularstructure may determine one or more properties of the carbon nanotubes.For example, the angle in which the two-dimensional sheets of grapheneare rolled may determine a chirality or type of the carbon nanotubesthat are formed, which may determine, at least in part, whether thecarbon nanotubes exhibit metallic or semiconductive properties.

In at least one embodiment, the hollow, tubular structure of the carbonnanotubes may include straight or bent sidewalls and the ends of thetubular structure may be open and/or closed. The carbon nanotubes may besingle-walled nanotubes, double-walled nanotubes, and/or multi-wallednanotubes. The carbon nanotubes may be purified carbon nanotubes and/orcrude carbon nanotubes (e.g., as synthesized). The carbon nanotubes maybe bare or pristine carbon nanotubes and/or functionalized carbonnanotubes. Pristine carbon nanotubes may include carbon nanotubes thathave not undergone any surface modifications and/or treatmentssubsequent to synthesis and/or purification thereof. Functionalizedcarbon nanotubes may include carbon nanotubes that may have undergone asurface modification and/or treatment such that one or more functionalchemical moiety or moieties are associated therewith. For example,functionalized carbon nanotubes may include carbon nanotubes that haveundergone a surface modification treatment such that one or morefunctional chemical moiety or moieties are associated with the sidewalls(i.e., inner and/or outer sidewalls) and/or the ends of the hollow,tubular structure. In at least one embodiment, the carbon nanotubes maybe functionalized with the chemical moiety or moieties to modify one ormore properties (e.g., mechanical, thermal, electrical, solubility,etc.) thereof.

In at least one embodiment, the thermally conductive fillers may bealigned or substantially aligned with one another within the materialsdisclosed herein. For example, the carbon nanotubes (or another fiber)may be aligned or substantially aligned with one another within thematerials disclosed herein. The carbon nanotubes may be dispersed in thematerials such that a longitudinal axis of the tubular structure of thecarbon nanotubes (or the fiber) may be aligned or substantially alignedwith one another. The alignment or substantial alignment of the carbonnanotubes along the respective longitudinal axes thereof may provide thematerials with one or more anisotropic properties. For example, thecarbon nanotubes may have increased mechanical strength along thelongitudinal axis of the tubular structure as compared to the mechanicalstrength normal or perpendicular to the longitudinal axis. Accordingly,the alignment or substantial alignment of the carbon nanotubes along therespective longitudinal axes thereof may provide the materials withincreased mechanical strength in the direction in which the longitudinalaxis of the carbon nanotubes are aligned as compared to the directionnormal to the longitudinal axis of the carbon nanotubes. In anotherembodiment, the carbon nanotubes may not be aligned or substantiallyaligned with one another within the materials. Instead, the carbonnanotubes may be randomly dispersed and/or entangled with one another.The random dispersion of the carbon nanotubes in the matrix material mayprovide the materials with increased mechanical strength as compared tothe materials without the carbon nanotubes.

The metals of the thermally conductive filler may be in the form ofpowders, particles, strands, or combinations thereof. Illustrativemetals may be or include, but are not limited to, one or more ofaluminum, nickel, copper, silver, gold, platinum, iron, cobalt, or thelike, or combinations thereof. In an exemplary implementation, the metalof the thermally conductive filler includes nickel nanostrands, aluminumpowder, aluminum particles, or combinations thereof.

The inorganic compounds may be or include any inorganic compound capableof or configured to increase the thermal conductivity of thecomposition, the composites, and/or the articles of manufacture.Illustrative inorganic compounds may be or include, but are not limitedto, boron nitride, oxides, such as silica, alumina, titania, yttria,zirconia, molybdenum oxide, iron oxide, or the like, or combinationsthereof. The inorganic compounds may be in the form of particles,powders, tubes (e.g., nanotubes, microtubes, etc.), fibers (e.g.,nanofibers, microfibers, etc.), or combinations thereof. In an exemplaryimplementation, the inorganic compounds may include boron nitride, suchas boron nitride nanotubes.

The one or more thermally conductive fillers may be present in thematerials disclosed herein in an amount of up to about 30 weight %, byweight of the total solids of the materials. For example, the thermallyconductive fillers may be present in an amount of from about 0.1 weight%, about 1 weight %, about 5 weight %, or about 10 weight % to about 15weight %, about 20 weight %, or about 30 weight %, by weight of thetotal solids of the materials.

The materials disclosed herein may be utilized in a variety of forms,including, but not limited to, fibers, mats (e.g., woven mats ornonwoven mats), cloths, fabrics, moldings, laminates, foams, moldedarticles, extruded shapes, or the like. The materials disclosed hereinmay be utilized in the variety of forms for various applications,including, but not limited to, aircraft and aerospace vehicles surfaces,ship hulls, ship surfaces, barge surfaces, oil rig surfaces, pipes,valves and pumps (e.g., interior and exterior), electrical transmissionwires and cables, filters, filtration components, electronic components,controlled fluid flow devices, medical implants, automobiles, trucks,motorcycles and boat surfaces, or the like.

In an exemplary embodiment, the materials disclosed herein may beutilized in one or more components of an automated fiber placement (AFP)machine. FIG. 1 illustrates a portion of an exemplary AFP machine 100,according to one or more embodiments. It should be appreciated by onehaving ordinary skill in the art that the AFP machine 100 illustrated inFIG. 1 may include one or more additional structural elements that arenot depicted. As illustrated in FIG. 1 , the AFP machine 100 may includea compaction roller 102 and a heat source 104. The compaction roller 102may be capable of or configured to receive a tape or prepreg 106 from afiber placement head (not shown) and contact the tape 106 with surfaces108 of a workpiece or substrate 110. As illustrated in FIG. 1 , thesubstrate 110 may be a contoured substrate. The heat source 104 may becapable of or configured to heat the prepreg 106 and/or the workpiece110 to facilitate adhesion therebetween.

In an exemplary operation of the AFP machine 100 with continuedreference to FIG. 1 , the prepreg 106 may be guided to the compactionroller 102 by the fiber placement head (not shown). The heat source 104may heat the prepreg 106 and/or the substrate 110, and the compactionroller 102 may adhere or otherwise place the prepreg 106 on the surface108 of the substrate 110. The compaction roller 102 may apply a force ina direction generally towards or normal to the substrate 110 to contactthe heated prepreg 106 with the surface 108 of the substrate 110,thereby adhering the prepreg 106 to the substrate 110.

In an exemplary embodiment, the materials disclosed herein may beutilized in the fabrication of the compaction roller 102 of the AFPmachine 100. The materials disclosed herein may be utilized in one ormore portions of the compaction roller 102. For example, the materialsdisclosed herein may be utilized as a coating or an outer layer 112 ofthe compaction roller 102. The materials disclosed herein may also beutilized in the fabrication of substantially all portions or an entirebody 114 of the compaction roller 102. The compaction roller 102 may befabricated from the materials disclosed herein via any suitable process.For example, the compaction roller 102 may be fabricated from thematerials disclosed herein by casting, molding, extruding, or the like.

As discussed above, the articles of manufacture fabricated from thematerials disclosed herein may exhibit a combination of bulk and surfaceproperties. As further discussed above, the combination of the bulk andsurface properties may be at least partially attributed to the migrationof the fluorine-containing portions or segments of thefluorine-containing alkyl ethers to respective exterior surfaces or airsurfaces of the articles, the presence of any one or more of thethermally conductive fillers, or combinations thereof. In an exemplaryembodiment, the compaction rollers 102 fabricated from the materialsdisclosed herein may exhibit comparable or improved thermal stability,chemical resistance, mechanical elongation, tensile strength, orcombinations thereof, as compared to bulk polyamides, while providingrelatively low or minimal adhesion (e.g., high water contact angles) atthe exterior surfaces and/or the outer layer 112 thereof. In addition tothe foregoing, the compaction rollers 102 fabricated from the materialsdisclosed herein and including the thermally conductive fillers mayexhibit improved thermal conductivity that may facilitate thedissipation or dispersion of heat from the compaction roller 102,thereby reducing or eliminating roller wraps during operation of the AFPmachine 100. The improved thermal conductivity of the compaction roller102 may also reduce or eliminate degradation or wear of the compactionroller 102 at operating temperatures (e.g., 250° C. to 400° C. or fromabout 250° C. to about 500° C.) of the AFP machine 100, thereby reducinginstances or occurrences of foreign object debris (FOD) being depositedonto the substrate 110.

The present disclosure has been described with reference to exemplaryimplementations. Although a limited number of implementations have beenshown and described, it will be appreciated by those skilled in the artthat changes may be made in these implementations without departing fromthe principles and spirit of the preceding detailed description. It isintended that the present disclosure be construed as including all suchmodifications and alterations insofar as they come within the scope ofthe appended claims or the equivalents thereof.

What is claimed is:
 1. A composition, comprising a polyamide, whereinthe polyamide is a polymeric reaction product of at least one diamineand an aromatic dicarboxylic acid, a hydroxy benzoic acid, or theirrespective ester or acyl halide derivatives, wherein the at least onediamine comprises an amino terminated perfluorinated alkyl ether polymeror oligomer represented by one or more of structures (1), (2), (3), (4),(5), (6), (7), (8), or a combination thereof:

(8) wherein x+y is about 6, a+b is about 2, and c is about 16 andwherein the composition comprises a thermal conductivity of from about0.2 to about 50 Watts per meter Kelvin (Wm-³¹ ¹K⁻¹).
 2. The compositionof claim 1, wherein the at least one diamine further comprises aphenylenediamine.
 3. The composition of claim 2, wherein thephenylenediamine comprises one or more of m-phenylenediamine,p-phenylenediamine, or combinations thereof.
 4. The composition of claim3, wherein the phenylenediamine comprises a m-phenylenedi amine.
 5. Thecomposition of claim 1, wherein the amino terminated perfluorinatedalkyl ether polymer or oligomer is represented by one or more ofstructures (1), (2), or combinations thereof.
 6. The composition ofclaim 1, wherein the amino terminated perfluorinated alkyl ether polymeror oligomer is represented by structure (3).
 7. The composition of claim1, wherein the amino terminated perfluorinated alkyl ether polymer oroligomer is represented by one or more of structures (4), (5), orcombinations thereof.
 8. The composition of claim 1, wherein the aminoterminated perfluorinated alkyl ether polymer or oligomer is representedby one or more of structures (6), (7), or combinations thereof.
 9. Thecomposition of claim 1, wherein the amino terminated perfluorinatedalkyl ether polymer or oligomer is represented by structure (8).
 10. Thecomposition of claim 1, wherein the amino terminated perfluorinatedalkyl ether polymer or oligomer is present in an amount of from greaterthan 0 weight % to about 20 weight %, by total weight of at least onediamine utilized in the synthesis of the polyamide.
 11. The compositionof claim 1, further comprising one or more thermally conductive fillers,wherein the thermally conductive fillers comprise one or more of acarbon-based filler, boron nitride, a metal, or combinations thereof.12. The composition of claim 11, wherein the thermally conductivefillers comprise the carbon-based filler, wherein the carbon-basedfiller comprises one or more of expanded graphite, carbon fibers, carbonnanotubes, carbon black, graphite, graphene, derivatives thereof, orcombinations thereof.
 13. The composition of claim 12, wherein thecarbon-based filler comprises the carbon fibers, wherein the carbonfibers comprise one or more of carbon nanofibers, metallized carbonnanofibers, vapor grown carbon nanofibers, or combinations thereof 14.The composition of claim 13, wherein the carbon fibers comprise themetallized carbon nanofibers, wherein the metallized carbon nanofiberscomprise carbon nanofibers coated or covalently bound with one or moreof silver, copper, nickel, or combinations thereof.
 15. The compositionof claim 11, wherein the thermally conductive fillers comprise thecarbon-based filler, and wherein the carbon-based filler isfunctionalized with one or more of a conductive metal, an aliphaticgroup, or combinations thereof.
 16. The composition of claim 11, whereinthe thermally conductive fillers comprise the carbon-based filler,wherein the carbon-based filler comprises carbon nanotubes, wherein thecarbon nanotubes comprise one or more of multi-walled carbon nanotubes,single-walled carbon nanotubes, or combinations thereof.
 17. Thecomposition of claim 11, wherein the thermally conductive fillerscomprise the metal, wherein the metal is in the form of particles,strands, or combinations thereof, and wherein the metal comprises one ormore of aluminum, nickel, or combinations thereof.
 18. A rollercomprising the composition of claim 1, wherein the roller comprises awater contact angle of greater than 95°48.
 19. A compaction roller foran automated fiber placement machine, the compaction roller comprising abody having an outer layer, wherein the outer layer of the bodycomprises the composition of claim
 1. 20. A compaction roller for anautomated fiber placement machine, the compaction roller comprising abody, wherein the entire body of the compaction roller is fabricatedfrom the composition of claim 1.